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  • 18.07.2025
TOWA (6315.F, Frankfurt)
Závěr k 18.7.2025 Změna (%) Změna (EUR) Objem obchodů (EUR)
10,70 -3,60 -0,40 905
R - Real-Time data si mohou aktivovat klienti Patria Plus / Investor Plus ZDE.

 
  • Poslední aktualizace:
Popis společnosti
Obecné informace
Název společnostiTOWA CORPORATION
Ticker6315
Kmenové akcie:Ordinary Shares
RIC6315.T
ISINJP3555700008
Poslední známé roční výsledky31.03.2019
Poslední známé čtvrtletní výsledky31.12.2019
Počet zaměstnanců k 31.03.2019 1 517
Akcie v oběhu k 31.12.2019 25 009 232
Počet akcionářů k 31.03.2019 10 194
MěnaJPY
Kontaktní informace
Ulice5, Kamitoba Kamichoshi-cho, Minami-ku
MěstoKYOTO-SHI
PSČ601-8105
ZeměJapan
Kontatní osoba 
Funkce kontaktní osoby 
Telefon81 756 920 250
Fax81756920270

Business Summary: TOWA CORPORATION is a Japan-based company mainly engaged in the manufacture and sale of precision molds for semiconductor manufacturing, semiconductor manufacturing equipment and fine plastic-molded parts. The Company operates in two business segments. The Semiconductor Manufacturing Equipment segment manufactures and sells semiconductor manufacturing precision molds, molding equipment and singulation equipment, among others. The Fine Plastic Moldings segment manufactures and sells medical equipment.
Financial Summary: BRIEF: For the nine months ended 31 December 2019, TOWA CORPORATION revenues decreased 12% to Y18.8B. Net income decreased 85% to Y79.2M. Revenues reflect Semiconductor Manufacturing Equip. Bus. segment decrease of 15% to Y16.37B. Net income also reflects Semiconductor Manufacturing Equip. Bus. segment income decrease of 79% to Y96.2M, Laser Processing Equipment Business segment loss increase from Y172K to Y82.8M.
Odvětvová klasifikace
TRBC2009Semiconductor Equipment / Testing
TRBC2012Semiconductor Machinery Manufacturing
RBSS2004Semiconductor Equipment & Testing
MGINDUSTRYSemiconductors
MGSECTORTechnology
NAICSSemiconductor Machinery Manufacturing
NAICSAll Other Plastics Product Manufacturing
NAICSWelding and Soldering Equipment Manufacturing
SICSpecial Industry MacHinery, Nec
SICPlastics Products, Nec
SICWelding Apparatus



  • Poslední aktualizace:
Management společnosti
FunkceJménoVěkVe funkci odVe firmě od
President, Chief Operating Officer, Representative DirectorHirokazu Okada6201.04.2012
Senior Managing Director, Director of Bando Memory Research InstituteTsuyoshi Amakawa6901.04.201428.06.2012
Managing Director, Chairman of SubsidiaryMakoto Fukutomi57
Managing Executive Officer, Chief Director of Administration, President of Subsidiary, DirectorYoshizumi Tamura6301.08.201827.06.2013
Managing Executive Officer, Dir of Mold Biz, Dir of System Business, Dir of System Manufacturing in Main System Biz Unit, ManageHiroshi Uragami5901.10.201701.04.2010
Senior Executive Officer, Chief Director of Sales, Chief Director of New Business Promotion, DirectorKoichi Ishida-01.04.201701.04.2010
Senior Ex Officer, Chief Dir of Dev, Dir of FMS Dev in Main Dev Unit, Dir of Bando Memorial Research Inst, Mngr of Product PlannNoboru Hayasaka-16.10.2019
Executive OfficerKiyoshige Gamo-01.10.201701.10.2014
Executive OfficerAtsushi Ito-01.10.201701.10.2017
Executive Officer, Manager of T & S & S OfficeMasatoshi Kishimoto-01.10.201301.04.2010