Detail akcie Besi Rg online

Business Summary: BE Semiconductor Industries N.V. (Besi) is a holding company. The Company is engaged in the development, manufacturing, marketing, sales and service of semiconductor assembly equipment for the global semiconductor and electronics industries. It operates through three segments: Die Attach, Packaging and Plating. It develops assembly processes and equipment for leadframe, substrate and wafer level packaging applications in a range of end user markets, including electronics, computer, automotive, industrial and solar energy. The Company offers products, such as Die attach equipment, which include single chip, multi-chip, multi module, flip chip, thermo-compression bonding (TCB) and enhanced wafer level ball grid array (eWLB) die bonding systems, and die sorting systems; Packaging equipment, which include wafer level molding and singulation systems, and Plating equipment, which include metal plating systems and related process chemicals.
Financial Summary: BRIEF: For the three months ended 31 March 2026, BE Semiconductor Industries NV revenues increased 28% to EUR184.9M. Net income increased 64% to EUR51.6M. Revenues reflect China segment increase from EUR40.5M to EUR84.2M, Asia Pacific (excl. China) segment increase of 34% to EUR75.2M. Net income benefited from Selling, general and admini decrease of 12% to EUR25.1M (expense), Net foreign currency losses increase from EUR100K to EUR600K (income).