Detail akcie Besi Rg online

Business Summary: BE Semiconductor Industries N.V. (Besi) is a holding company. The Company is engaged in the development, manufacturing, marketing, sales and service of semiconductor assembly equipment for the global semiconductor and electronics industries. It operates through three segments: Die Attach, Packaging and Plating. It develops assembly processes and equipment for leadframe, substrate and wafer level packaging applications in a range of end user markets, including electronics, computer, automotive, industrial and solar energy. The Company offers products, such as Die attach equipment, which include single chip, multi-chip, multi module, flip chip, thermo-compression bonding (TCB) and enhanced wafer level ball grid array (eWLB) die bonding systems, and die sorting systems; Packaging equipment, which include wafer level molding and singulation systems, and Plating equipment, which include metal plating systems and related process chemicals.
Financial Summary: BRIEF: For the fiscal year ended 31 December 2024, BE Semiconductor Industries NV revenues increased 5% to EUR607.5M. Net income increased 3% to EUR182M. Revenues reflect Die Attach segment increase of 10% to EUR490.5M, Other segment increase of 71% to EUR970K. Net income was partially offset by Selling, general and administrative expe increase of 19% to EUR120M (expense).