Detail akcie BE Semiconductor Depository Receipt online

Business Summary: BE Semiconductor Industries N.V. (Besi) is a holding company. The Company is engaged in the development, manufacturing, marketing, sales and service of semiconductor assembly equipment for the global semiconductor and electronics industries. It operates through three segments: Die Attach, Packaging and Plating. It develops assembly processes and equipment for leadframe, substrate and wafer level packaging applications in a range of end user markets, including electronics, computer, automotive, industrial and solar energy. The Company offers products, such as Die attach equipment, which include single chip, multi-chip, multi module, flip chip, thermo-compression bonding (TCB) and enhanced wafer level ball grid array (eWLB) die bonding systems, and die sorting systems; Packaging equipment, which include wafer level molding and singulation systems, and Plating equipment, which include metal plating systems and related process chemicals.
Financial Summary: BRIEF: For the nine months ended 30 September 2024, BE Semiconductor Industries NV (ADR) revenues increased 8% to EUR454.1M. Net income increased less than 1% to EUR122.7M. Revenues reflect Packaging segment increase of 5% to EUR54.8M, Die Attach segment increase of 1% to EUR234.4M, EU / USA / Other segment increase of 23% to EUR143.3M, China segment increase of 13% to EUR161.5M.