Detail akcie Besi Rg online

Business Summary: BE Semiconductor Industries N.V. (Besi) is a holding company. The Company is engaged in the development, manufacturing, marketing, sales and service of semiconductor assembly equipment for the global semiconductor and electronics industries. It operates through three segments: Die Attach, Packaging and Plating. It develops assembly processes and equipment for leadframe, substrate and wafer level packaging applications in a range of end user markets, including electronics, computer, automotive, industrial and solar energy. The Company offers products, such as Die attach equipment, which include single chip, multi-chip, multi module, flip chip, thermo-compression bonding (TCB) and enhanced wafer level ball grid array (eWLB) die bonding systems, and die sorting systems; Packaging equipment, which include wafer level molding and singulation systems, and Plating equipment, which include metal plating systems and related process chemicals.
Financial Summary: BRIEF: For the six months ended 30 June 2026, BE Semiconductor Industries NV revenues increased 49% to EUR434.7M. Net income increased from EUR63.6M to EUR140.6M. Revenues reflect Die Attach segment increase of 56% to EUR366.6M, Packaging segment increase of 27% to EUR59.7M, China segment increase from EUR78.1M to EUR182.5M, Asia Pacific (excl. China) segment increase of 61% to EUR196.1M. Net income benefited from Selling.