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  • 26.04.2024 22:00:00
Amkor Technology (AMKR.O, NASDAQ Cons)
Poslední obchod Změna (%) Změna (USD) Objem obchodů (ks)
30,62 1,76 0,53 739 623
R - Real-Time data si mohou aktivovat klienti Patria Plus / Investor Plus ZDE.

 
  • Poslední aktualizace: 27.04.2024
Popis společnosti
Obecné informace
Název společnostiAmkor Technology, Inc.
TickerAMKR
Kmenové akcie:Ordinary Shares
RICAMKR.O
ISIN-
Poslední známé roční výsledky31.12.2023
Poslední známé čtvrtletní výsledky31.12.2023
Počet zaměstnanců k 31.12.2023 28 700
Akcie v oběhu k 22.03.2024 246 155 251
MěnaUSD
Konstituent indexůS&P 400 Mid Cap
Kontaktní informace
Ulice2045 East Innovation Circle
MěstoTEMPE
PSČ85284
ZeměUnited States
Kontatní osobaJennifer Jue
Funkce kontaktní osobyVice President - Investor Relations
Telefon14 808 215 000
Fax14808218276
Kontatní telefon14 807 867 594

Business Summary: Amkor Technology, Inc. is a provider of outsourced semiconductor packaging and test services. The Company is engaged in the outsourcing of semiconductor packaging and test services. It designs and develops packaging and test technologies focused on advanced packaging solutions, including artificial intelligence. Its packaging and test services are designed to meet application and chip-specific requirements, including: the required type of interconnect technology; size; thickness; and electrical, mechanical, and thermal performance. It provides turnkey packaging and test services including semiconductor wafer bump, wafer probe, wafer back-grind, package design, packaging, system-level and final test and drop shipment services. The Company offers services to integrated device manufacturers (IDMs), fabless semiconductor companies, original equipment manufacturers (OEMs) and contract foundries. It allows IDMs to outsource packaging and test services and focus their investments.
Financial Summary: BRIEF: For the fiscal year ended 31 December 2023, Amkor Technology, Inc. revenues decreased 8% to $6.5B. Net income decreased 53% to $359.8M. Revenues reflect Advanced products segment decrease of 6% to $5.03B, Mainstream products segment decrease of 15% to $1.47B, Asia Pacific -(Excluding Japan) segment decrease of 31% to $704.5M, Japan segment decrease of 17% to $935.6M.
Odvětvová klasifikace
TRBC2009Semiconductors
TRBC2012Semiconductor Equipment & Testing (NEC)
RBSS2004Semiconductors
MGINDUSTRYSemiconductors
MGSECTORTechnology
NAICSSemiconductor and Related Device Manufacturing
NAICS2007Semiconductor & Related Device Mfg
NAICS1997Semiconductor and Related Device Manufacturing
SICSemiconductors/related Devices
SICSemiconductors/related Devices



  • Poslední aktualizace: 27.04.2024
Management společnosti
FunkceJménoVěkVe funkci odVe firmě od
Executive Chairman of the BoardJu Jin Kim8701.10.2009
President, Chief Executive Officer, DirectorGiel Rutten6517.06.202015.01.2014
Executive Vice Chairman of the BoardSusan Kim6019.05.2020
Chief Financial Officer, Executive Vice President, TreasurerMegan Faust5001.01.2003
Executive Vice President, General Counsel, Corporate SecretaryMark Rogers5710.06.201910.06.2019
Executive Vice President - Business UnitsKevin Engel51
Executive Vice President, Chief Sales OfficerFarshad Haghighi60
Executive Vice President - Worldwide ManufacturingJinan Lee-15.12.202315.12.2023