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  • 08.07.2025
Amkor Technology (AMKR.O, NASDAQ Cons)
Závěr k 8.7.2025 Změna (%) Změna (USD) Objem obchodů (ks)
22,10 3,08 0,66 1 616 458
R - Real-Time data si mohou aktivovat klienti Patria Plus / Investor Plus ZDE.

 
  • Poslední aktualizace: 09.07.2025
Popis společnosti
Obecné informace
Název společnostiAmkor Technology Inc
TickerAMKR
Kmenové akcie:Ordinary Shares
RICAMKR.O
ISIN-
Poslední známé roční výsledky31.12.2024
Poslední známé čtvrtletní výsledky31.03.2025
Počet zaměstnanců k 31.12.2024 28 300
Akcie v oběhu k 22.04.2025 247 056 288
MěnaUSD
Konstituent indexůS&P 400 Mid Cap
Kontaktní informace
Ulice2045 East Innovation Circle
MěstoTEMPE
PSČ85284
ZeměUnited States
Kontatní osobaJennifer Jue
Funkce kontaktní osobyVice President - Investor Relations
Telefon14 808 215 000
Fax14808218276
Kontatní telefon14 807 867 594

Business Summary: Amkor Technology, Inc. is a provider of outsourced semiconductor packaging and test services. The Company is engaged in the outsourcing of semiconductor packaging and test services. It designs and develops packaging and tests technologies focused on advanced packaging solutions, including artificial intelligence. Its packaging and test services are designed to meet application and chip-specific requirements, including: the required type of interconnect technology; size; thickness; electrical, mechanical, and thermal performance. It provides turnkey packaging and test services including semiconductor wafer bump, wafer probe, wafer back-grind, package design, packaging, system-level and final test and drop shipment services. The Company offers services to integrated device manufacturers (IDMs), fabless semiconductor companies, original equipment manufacturers (OEMs) and contract foundries. It allows IDMs to outsource packaging and test services and focus their investments.
Financial Summary: BRIEF: For the three months ended 31 March 2025, Amkor Technology Inc revenues decreased 3% to $1.32B. Net income decreased 64% to $21.1M. Revenues reflect Mainstream products segment decrease of 13% to $258M, Advanced products segment decrease of 1% to $1.06B. Net income also reflects Research and development increase of 20% to $45.7M (expense), Interest income decrease of 14% to $14.5M (income). Dividend per share remained flat at $0.08.
Odvětvová klasifikace
TRBC2009Semiconductors
TRBC2012Semiconductor Equipment & Testing (NEC)
RBSS2004Semiconductors
MGINDUSTRYSemiconductors
MGSECTORTechnology
NAICSSemiconductor and Related Device Manufacturing
NAICS2007Semiconductor & Related Device Mfg
NAICS1997Semiconductor and Related Device Manufacturing
SICSemiconductors/related Devices
SICSemiconductors/related Devices



  • Poslední aktualizace: 09.07.2025
Management společnosti
FunkceJménoVěkVe funkci odVe firmě od
Chairman of the Board, Chief Executive OfficerAndrew Silvernail5401.10.202401.05.2024
Chief Financial Officer, Senior Vice PresidentLance Loeffler4801.04.202501.04.2025
Senior Vice President, Chief Strategy Officer, Chief People OfficerJoy Roman4603.02.202503.02.2025
Executive Vice President and President - North American Packaging SolutionsW. Thomas Hamic5801.09.2024
Executive Vice President, President DS SmithTimothy Nicholls6301.04.202501.12.2007
Senior Vice President, General Counsel, and Corporate SecretaryJoseph Saab56
Senior Vice PresidentClayton Ellis5404.01.2023
Senior Vice President- Containerboard, RecyclingJames Royalty5404.01.202301.01.2017