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  • 13.12.2024 21:26:01
Amtech Systems (ASYS.O, NASDAQ Cons)
Poslední obchod Změna (%) Změna (USD) Objem obchodů (ks)
5,65 0,44 0,03 19 466
R - Real-Time data si mohou aktivovat klienti Patria Plus / Investor Plus ZDE.

 
  • Poslední aktualizace: 13.12.2024
Popis společnosti
Obecné informace
Název společnostiAmtech Systems, Inc.
TickerASYS
Kmenové akcie:Ordinary Shares
RICASYS.O
ISIN-
Prioritní akcieConv. Pref. Shrs Series A
Poslední známé roční výsledky30.09.2023
Poslední známé čtvrtletní výsledky30.06.2024
Počet zaměstnanců k 30.09.2023 405
Akcie v oběhu k 02.08.2024 14 218 795
MěnaUSD
Kontaktní informace
Ulice58 S River Drive Suite 370
MěstoTEMPE
PSČ85288
ZeměUnited States
Kontatní osoba 
Funkce kontaktní osoby 
Telefon14 809 675 146
Fax14809683763

Business Summary: Amtech Systems, Inc. is a manufacturer of thermal processing, wafer cleaning and chemical mechanical polishing (CMP) capital equipment and related consumables used in semiconductor, advanced mobility and renewable energy manufacturing applications. The Company's segments include semiconductor, and material and substrate. The semiconductor segment is engaged in the supply of thermal processing equipment, including solder reflow ovens, horizontal diffusion furnaces, and custom high-temp belt furnaces for use by semiconductor, electronics and electro/mechanical assembly manufacturers. The material and substrate segment is engaged in the production of wafer cleaning equipment as well as substrate consumables and chemicals for lapping (fine abrading) and polishing of materials, such as silicon wafers for semiconductor products, sapphire wafers for light-emitting diode (LED) applications, and compound substrates, like silicon carbide (SiC) wafers, for power device applications.
Financial Summary: BRIEF: For the nine months ended 30 June 2024, Amtech Systems, Inc. revenues decreased 10% to $77.1M. Net loss increased from $567K to $8M. Revenues reflect Semiconductor segment decrease of 10% to $53M, Material and Substrate segment decrease of 10% to $24.1M, Other Europe segment decrease of 58% to $4.6M, Canada segment decrease of 89% to $771K, Austria segment decrease of 82% to $771K.
Odvětvová klasifikace
TRBC2009Semiconductor Equipment / Testing
TRBC2012Semiconductor Equipment & Testing (NEC)
RBSS2004Semiconductor Equipment & Testing
MGINDUSTRYSemiconductors
MGSECTORTechnology
NAICSSemiconductor Machinery Manufacturing
NAICSSemiconductor and Related Device Manufacturing
NAICSOther Electronic Component Manufacturing
NAICSAll Other Industrial Machinery Manufacturing
NAICS2007Semiconductor Machinery Mfg
NAICS2007Semiconductor & Related Device Mfg
NAICS2007Other Electronic Component Mfg
NAICS2007All Other Industrial Machinery Mfg
NAICS1997Semiconductor Machinery Manufacturing
NAICS1997Semiconductor and Related Device Manufacturing
NAICS1997Other Electronic Component Manufacturing
NAICS1997All Other Industrial Machinery Manufacturing
SICSpecial Industry MacHinery, Nec
SICSpecial Industry MacHinery, Nec
SICSemiconductors/related Devices
SICElectronic Components, Nec



  • Poslední aktualizace: 13.12.2024
Management společnosti
FunkceJménoVěkVe funkci odVe firmě od
Chairman of the Board, President, Chief Executive OfficerRobert Daigle6008.08.202308.08.2023
Chief Financial OfficerWade Jenke4108.08.202408.08.2024