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  • 06.02.2026
Amtech Systems (ASYS.O, NASDAQ Cons)
Závěr k 6.2.2026 Změna (%) Změna (USD) Objem obchodů (USD)
11,12 -29,93 -4,75 14 400 471
R - Real-Time data si mohou aktivovat klienti Patria Plus / Investor Plus ZDE.

 
  • Poslední aktualizace: 08.02.2026
Popis společnosti
Obecné informace
Název společnostiAmtech Systems Inc
TickerASYS
Kmenové akcie:Ordinary Shares
RICASYS.O
ISIN-
Prioritní akcieConv. Pref. Shrs Series A
Poslední známé roční výsledky30.09.2025
Poslední známé čtvrtletní výsledky31.12.2025
Počet zaměstnanců k 30.09.2025 264
Akcie v oběhu k 13.01.2026 14 394 885
MěnaUSD
Kontaktní informace
Ulice58 S River Drive Suite 370
MěstoTEMPE
PSČ85288
ZeměUnited States
Kontatní osobaMark Weaver
Funkce kontaktní osobyInterim Chief Financial Officer, Company Secretary
Telefon14 809 675 146
Fax14809683763
Kontatní telefon14 803 603 756

Business Summary: Amtech Systems, Inc. is a global manufacturer of thermal processing, wafer cleaning and chemical mechanical polishing (CMP) capital equipment and related consumables used in semiconductor, advanced mobility and renewable energy manufacturing applications. The Company’s segment includes Thermal Processing Solutions and Semiconductor Fabrication Solutions. The Thermal Processing Solutions include reflow equipment for chip packaging and electronic assembly, diffusion furnaces and furnaces used to produce ceramic-based power semiconductor packages and passive electronic components. The Semiconductor Fabrication Solutions include consumables, equipment and services for wafer polishing, cleaning, slicing and dicing. It sells process equipment and services used in the fabrication of semiconductor devices, such as silicon carbide (SiC), silicon power, electronic assemblies and modules to semiconductor device and module manufacturers globally, particularly in Asia, North America and Europe.
Financial Summary: BRIEF: For the fiscal year ended 30 September 2025, Amtech Systems Inc revenues decreased 22% to $79.4M. Net loss increased from $8.5M to $30.3M. Revenues reflect Thermal processing solutions segment decrease of 16% to $58.1M, Semi conductor fabrications solutions segment decrease of 34% to $21.3M, United States segment decrease of 38% to $45.2M, Other Europe segment decrease of 12% to $3.4M.
Odvětvová klasifikace
TRBC2009Semiconductor Equipment / Testing
TRBC2012Semiconductor Equipment & Testing (NEC)
RBSS2004Semiconductor Equipment & Testing
MGINDUSTRYSemiconductors
MGSECTORTechnology
NAICSSemiconductor Machinery Manufacturing
NAICSSemiconductor and Related Device Manufacturing
NAICSOther Electronic Component Manufacturing
NAICSIndustrial Process Furnace and Oven Manufacturing
NAICSAir-Conditioning and Warm Air Heating Equipment and Commercial and Industrial Refrigeration Equipment Manufacturing
NAICS2007Semiconductor Machinery Mfg
NAICS2007Semiconductor & Related Device Mfg
NAICS2007Other Electronic Component Mfg
NAICS2007All Other Industrial Machinery Mfg
NAICS1997Semiconductor Machinery Manufacturing
NAICS1997Semiconductor and Related Device Manufacturing
NAICS1997Other Electronic Component Manufacturing
NAICS1997All Other Industrial Machinery Manufacturing
SICSpecial Industry MacHinery, Nec
SICSpecial Industry MacHinery, Nec
SICSemiconductors/related Devices
SICElectronic Components, Nec
SICIndustrial Furnaces And Ovens
SICRefrigeration/heating Equipment



  • Poslední aktualizace: 08.02.2026
Management společnosti
FunkceJménoVěkVe funkci odVe firmě od
Chairman of the Board, President, Chief Executive OfficerRobert Daigle6208.08.202308.08.2023
Interim Chief Financial Officer, Company SecretaryMark Weaver6516.12.202516.12.2025