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  • 08.04.2026
Aspocomp Group (Helsinki)
Závěr k 8.4.2026 Změna (%) Změna (EUR) Objem obchodů (EUR)
4,70 -1,67 -0,08 35 449
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  • Poslední aktualizace:
Popis společnosti
Obecné informace
Název společnostiAspocomp Group Oyj
TickerACG1V
Kmenové akcie:Ordinary Shares
RICACG1V.HE
ISINFI0009008080
Poslední známé roční výsledky31.12.2025
Poslední známé čtvrtletní výsledky31.12.2025
Počet zaměstnanců k 31.12.2025 170
Akcie v oběhu k 31.12.2025 7 522 922
MěnaEUR
Kontaktní informace
UliceKeilaranta 1
MěstoESPOO
PSČ02150
ZeměFinland
Kontatní osoba 
Funkce kontaktní osoby 
Telefon358 207 756 860
Fax358207756868

Business Summary: Aspocomp Group Oyj is a Finland-based company engaged in the manufacture and sell of printed circuit boards (PCBs). Its products are used in a number of applications, such as automotive electronics, telecommunication infrastructure, mobile devices, and industrial electronics. The Company’s product portfolio comprises a range of PBCs, including High Density Interconnections (HDI), Multilayer and Backplane, High Frequency, Insulator Metal Substrates (IMS), as well as PCBs with cooling features. Furthermore, It offers Design For Manufacturing (DFM) Feedback, and logistics services, among others. The Company is a parent of AC Shenzhen Electronics Co, Aspocomp Trading Oy, Aspocomp Oulu Oy, Aspocomp GmbH and Aspocomp Ab.
Financial Summary: BRIEF: For the fiscal year ended 31 December 2025, Aspocomp Group Oyj revenues increased 38% to EUR38.2M. Net income totaled EUR414K vs. loss of EUR3.5M. Revenues reflect Semiconductor R&D and IC testing segment increase from EUR8.5M to EUR17.5M, Security and Defence segment increase of 44% to EUR9.3M, Finland segment increase of 46% to EUR5.9M. Net Income reflects Depreciation decrease of 24% to EUR1.2M (expense).
Odvětvová klasifikace
TRBC2009Semiconductors
TRBC2012Integrated Circuits
RBSS2004Semiconductors
MGINDUSTRYSemiconductors
MGSECTORTechnology
NAICSBare Printed Circuit Board Manufacturing
NAICSPrinted Circuit Assembly (Electronic Assembly) Manufacturing
NAICSSemiconductor and Related Device Manufacturing
NAICSOffices of Other Holding Companies
NAICS2007Bare Printed Circuit Board Mfg
NAICS2007Printed Circuit Assembly (Electronic Assembly) Mfg
NAICS2007Semiconductor & Related Device Mfg
NAICS2007Offices of Other Holding Companies
NAICS1997Printed Circuit Board Manufacturing
NAICS1997Printed Circuit/Electronics Assembly Manufacturing
NAICS1997Semiconductor and Related Device Manufacturing
NAICS1997Offices of Other Holding Companies
SICPrinted Circuit Boards
SICElectronic Components, Nec
SICSemiconductors/related Devices
SICHolding Companies, Nec



  • Poslední aktualizace:
Management společnosti
FunkceJménoVěkVe funkci odVe firmě od
President, Chief Executive Officer, Member of the Management BoardManu Skytta-20.05.202420.05.2024
Deputy Chief Executive Officer, Chief Commercial Officer, Member of the Management BoardAntti Ojala4208.01.202401.11.2013
Chief Financial Officer, Member of the Management TeamTerhi Launis5401.09.202501.09.2025
Chief Operating Officer, Member of the Management BoardPekka Holopainen-08.01.202408.01.2024
Chief Technology Officer, Member of the Management TeamMitri Mattila4526.02.201826.02.2018
Director of Human Resources, Member of the Management BoardHanna-leena Keskitalo4120.01.202520.01.2025