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  • 23.04.2024 12:27:23
Aspocomp Group (Helsinki)
Poslední obchod Změna (%) Změna (EUR) Objem obchodů (EUR)
3,03 -1,30 -0,04 8 011
R - Real-Time data si mohou aktivovat klienti Patria Plus / Investor Plus ZDE.

 
  • Poslední aktualizace: 23.04.2024
Popis společnosti
Obecné informace
Název společnostiAspocomp Group Oyj
TickerACG1V
Kmenové akcie:Ordinary Shares
RICACG1V.HE
ISINFI0009008080
Poslední známé roční výsledky31.12.2023
Poslední známé čtvrtletní výsledky31.03.2024
Počet zaměstnanců k 31.03.2024 163
Akcie v oběhu k 31.03.2024 6 841 440
MěnaEUR
Kontaktní informace
UliceKeilaranta 1
MěstoESPOO
PSČ02150
ZeměFinland
Kontatní osobaMikko Montonen
Funkce kontaktní osobyChairman of the Management Team, President, Chief Executive Officer, IR Contact Officer
Telefon358 207 756 860
Fax358207756868
Kontatní telefon358 207 756 860

Business Summary: Aspocomp Group Oyj is a Finland-based company engaged in the manufacture and sell of printed circuit boards (PCBs). Its products are used in a number of applications, such as automotive electronics, telecommunication infrastructure, mobile devices, and industrial electronics. The Company’s product portfolio comprises a range of PBCs, including High Density Interconnections (HDI), Multilayer and Backplane, High Frequency, Insulator Metal Substrates (IMS), as well as PCBs with cooling features. Furthermore, It offers Design For Manufacturing (DFM) Feedback, and logistics services, among others. The Company is a parent of AC Shenzhen Electronics Co, Aspocomp Trading Oy, Aspocomp Oulu Oy, Aspocomp GmbH and Aspocomp Ab.
Financial Summary: BRIEF: For the three months ended 31 March 2024, Aspocomp Group Oyj revenues decreased 30% to EUR6.2M. Net loss applicable to common stockholders totaled EUR1.7M vs. income of EUR305K. Revenues reflect a decrease in demand for the Company's products and services due to unfavorable market conditions. Net loss reflects Personnel expenses increase of 7% to EUR2.6M (expense), Other Operating Income decrease of 95% to EUR2K (income).
Odvětvová klasifikace
TRBC2009Semiconductors
TRBC2012Integrated Circuits
RBSS2004Semiconductors
MGINDUSTRYSemiconductors
MGSECTORTechnology
NAICSBare Printed Circuit Board Manufacturing
NAICSPrinted Circuit Assembly (Electronic Assembly) Manufacturing
NAICSSemiconductor and Related Device Manufacturing
NAICSOffices of Other Holding Companies
NAICS2007Bare Printed Circuit Board Mfg
NAICS2007Printed Circuit Assembly (Electronic Assembly) Mfg
NAICS2007Semiconductor & Related Device Mfg
NAICS2007Offices of Other Holding Companies
NAICS1997Printed Circuit Board Manufacturing
NAICS1997Printed Circuit/Electronics Assembly Manufacturing
NAICS1997Semiconductor and Related Device Manufacturing
NAICS1997Offices of Other Holding Companies
SICPrinted Circuit Boards
SICElectronic Components, Nec
SICSemiconductors/related Devices
SICHolding Companies, Nec



  • Poslední aktualizace: 23.04.2024
Management společnosti
FunkceJménoVěkVe funkci odVe firmě od
Chairman of the Management Team, President, Chief Executive Officer, IR Contact OfficerMikko Montonen5215.05.2014
Deputy Chief Executive Officer, Chief Commercial Officer, Member of the Management BoardAntti Ojala4208.01.202401.11.2013
Member of the Management Team, Chief Financial OfficerJouni Kinnunen5719.09.201119.09.2011
Chief Operating Officer, Member of the Management BoardPekka Holopainen-08.01.202408.01.2024
Chief Technology Officer, Member of the Management TeamMitri Mattila4526.02.201826.02.2018