Detail akcie Besi Rg online

Business Summary: BE Semiconductor Industries N.V. (Besi) is a holding company. The Company is engaged in the development, manufacturing, marketing, sales and service of semiconductor assembly equipment for the global semiconductor and electronics industries. It operates through three segments: Die Attach, Packaging and Plating. It develops assembly processes and equipment for leadframe, substrate and wafer level packaging applications in a range of end user markets, including electronics, computer, automotive, industrial and solar energy. The Company offers products, such as Die attach equipment, which include single chip, multi-chip, multi module, flip chip, thermo-compression bonding (TCB) and enhanced wafer level ball grid array (eWLB) die bonding systems, and die sorting systems; Packaging equipment, which include wafer level molding and singulation systems, and Plating equipment, which include metal plating systems and related process chemicals.
Financial Summary: BRIEF: For the fiscal year ended 31 December 2025, BE Semiconductor Industries NV revenues decreased 3% to EUR591.3M. Net income decreased 28% to EUR131.6M. Revenues reflect Die Attach segment decrease of 3% to EUR474.1M, Packaging segment decrease of 1% to EUR99.1M, Malaysia segment decrease from EUR18K to EUR0K. Net income also reflects Research and development expenses - Bala increase of 11% to EUR85.4M (expense).