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  • 13.02.2026
ChipMOS TECH Sp ADR (NASDAQ Cons)
Závěr k 13.2.2026 Změna (%) Změna (USD) Objem obchodů (USD)
35,34 -0,37 -0,13 425 710
R - Real-Time data si mohou aktivovat klienti Patria Plus / Investor Plus ZDE.

 
  • Poslední aktualizace: 15.02.2026
Popis společnosti
Obecné informace
Název společnostiChipMOS Technologies Inc - ADR
TickerIMOS
Kmenové akcie:ADR
RICIMOS.O
ISIN-
Poslední známé roční výsledky31.12.2024
Poslední známé čtvrtletní výsledky30.09.2025
Počet zaměstnanců k 31.12.2024 5 890
Akcie v oběhu k 30.09.2025 699 970 000
MěnaTWD
Kontaktní informace
UliceNo.1
MěstoBAOSHAN
PSČ300
ZeměTaiwan
Kontatní osoba 
Funkce kontaktní osoby 
Telefon88 635 770 055
Fax88635668989

Business Summary: ChipMOS Technologies Inc is a Taiwan-based company mainly engaged in the integrated circuits (IC) packaging and testing business. The company's major products and services include multi-chip packaging, thin small-outline packages (TSOP), ball grid array (BGA) packaging and chip on film (COF) packaging services, as well as wafer bumping, wafer-level chip-size packaging, and wafer-overpackaging technologies. The Company's packaged and tested products are mainly used in automotive, information, communication, mobile phone, wearable and consumer electronics related products. The Company also provides customers with full-stage processing and distribution services. The Company mainly operates its businesses within domestic market and overseas markets, including the rest of Asia and the Americas.
Financial Summary: BRIEF: For the nine months ended 30 September 2025, ChipMOS Technologies Inc - ADR revenues increased 1% to NT$17.41B. Net loss totaled NT$4.6M vs. income of NT$1.19B. Revenues reflect Packaging segment increase of 19% to NT$4.79B, Testing segment increase of 9% to NT$4.09B, Wafer Bump segment increase of 7% to NT$4.11B. Net loss reflects LCD Display IC segment income decrease of 96% to NT$47.8M.
Odvětvová klasifikace
TRBC2009Semiconductors
TRBC2012Semiconductor Equipment & Testing (NEC)
MGINDUSTRYContainers & Packaging
MGSECTORBasic Materials
NAICSPackaging Machinery Manufacturing
NAICSSemiconductor and Related Device Manufacturing
NAICSInstrument Manufacturing for Measuring and Testing Electricity and Electrical Signals
NAICS2007Semiconductor & Related Device Mfg
NAICS2007Electricity Measuring/Testing Instrument Mfg
NAICS1997Semiconductor and Related Device Manufacturing
NAICS1997Instrument Manufacturing for Measuring and Testing Electricity and Electrical Signals
SICPackaging MacHinery
SICSemiconductors/related Devices
SICInstruments To Measure Electric



  • Poslední aktualizace: 15.02.2026
Management společnosti
FunkceJménoVěkVe funkci odVe firmě od
Chairman of the Board, General ManagerShih-Jye Cheng-17.07.199717.07.1997
Deputy General Manager-Finance & Accounting Management Center, Corporate Governance Officer, DirectorSilvia Su-12.07.202101.10.2017
Senior Deputy General Manager-Strategy & Investor RelationsJesse Huang-17.04.2007
Deputy General Manager - LCDD Production GroupKuang-Hui Chen-01.03.202401.03.2024
Executive Deputy General Manager-TN Operation Manufacturing CenterYuan-Feng Hsu-01.07.2020
Deputy General Manager-Driver IC Sales Account DivisionMing-Cheng Lin-01.06.201401.06.2014
Deputy General Manager - Memory and Mixed-signal Testing Production GroupChun-I Liu-01.12.202301.12.2023
Executive Deputy General Manager-HC Operation Manufacturing CenterTeng-Yueh Tsai-20.07.202106.03.2012